Several true wireless Bluetooth headsets released by Redmi are basically included in eWiseTech. It was also found that the appearance of AirDots2 and Bluetooth Soc are similar to the first generation. Is there any change in the AirDots3 that I started this time?
Start with the headset first.
First remove the earplugs, there is a fine dust-proof net at the sound hole.
The earphone is fixed by a buckle, and the earphone is disassembled along the position of the fuselage mold line. On the top is a whole piece of FPC soft board with two contacts. The upper part is the antenna contact, and the lower part is the touch control contact. The metal contact is directly connected with the spring probe on the main board.
Pry open the main board, you can see the soft pack battery and the speaker, which are respectively soldered to the main board through wires of different colors, and the FPC soft board of the charging board is also soldered to the main board.
The battery on the back of the motherboard is covered with transparent double-sided tape, and the microphone is covered with a white silicone cover. In order to avoid falling off, the silicone cover is also coated with glue for fixing.
White adhesive is all around the charging board. Use a crowbar to remove.
There is also a light sensor on the charging board with a black plastic protective cover.
Separate the speaker and the front cover. The front cover is covered with glue, and there are two holes where the wires pass through the glue.
Inside the speaker cover are the moving coil and moving iron, and the moving iron is covered with a white silicone sleeve.
The main IC on the front of the motherboard (picture below):
1:Qualcomm-QCC3040-Bluetooth 5.2 Audio SoC
Main IC on the back of the motherboard (pictured below):
1: Touch control chip
Since the shell is fixed by a buckle, the overall difficulty of disassembling the headset is relatively simple. Only the charging module is fixed with white adhesive, and only the earphones are filled with white adhesive.
This is the end of the headphone disassembly, and then the disassembly of the headphone box.
The inner support is fixed with four buckles, we use a crowbar to open it, and the buckle position is also coated with black glue for reinforcement. Be careful after opening, the battery is pasted on the case with transparent double-sided tape.
The battery is welded to the main board of the charging box by copper wire, and black foam is attached to the corresponding position on the main board.
The motherboard is fixed on the inner support with 3 screws. There is a DIP packaged plug-in device on the motherboard, which is a Hall device.
There are five magnets on the inner support, four are used to fix the earphone for charging, and one is used to fix the upper cover of the shell. All are reinforced with glue.
The main IC on the front of the main board of the charging box (below):
1: CHIPSEA-CSU32P20-Single-chip MCU
2: Hall sensor
3: charging chip
The disassembly of the charging box is also relatively simple. It is only fixed by glue at the buckle. What is more special is a Hall device used to detect the opening and closing of the lid on the main board, and the plug-in device in DIP package is selected. (Editor: Judy)
The dismantling and analysis of Redmi AirDots 3 has come to an end. If you want to know more detailed information about the whole machine, you can go to the eWisetech search database.
Friends who are interested in digital products, remember to pay more attention to eWisetech to learn about dismantling equipment information as soon as possible. Finally, I remind everyone that there are various digital product evaluation and disassembly in eWisetech, you can check it step by step!
Phone: Samsung Galaxy F52 5G
Smart home: AirTag
Smart wear : Redmi AirDots 2