According to foreign media MacRumors, Apple may use a smaller "S7" chip on the upcoming Apple Watch Series 7 to make room for batteries or other sensors.
In addition, Taiwanese media DigiTimes cited supply chain news that Apple Watch Series 7 will use the double-sided structure integrated SiP (System in Package) package provided by Taiwan ASE Semiconductor.
SiP package is a multi-level package with a 3D structure, which encapsulates multiple functional chips, processors, and memories together, greatly reducing the footprint of components. Earlier, Apple used SiP packaging on AirPods Pro, saving a lot of space for placing larger batteries, sensors and other equipment. Due to this huge advantage of SiP packaging, Xiaolei expects that the packaging technology will be used in more and more miniaturized wearable devices .
According to a previous Bloomberg report, Apple Watch Series 7 will be jointly released with the iPhone 13 series in September. The new watch will use a sapphire screen cover, and the display will be closer to the surface, bringing better display effects. The new watch will also be equipped with UWB ultra-bandwidth wireless carrier communication technology. In addition, Apple has also applied the technology on the iPhone and AirTag, and Apple may also support this technology on other devices in the future.
The whistleblower Jon Prosser has indicated that Apple Watch Series 7 will adopt a flatter, right-angled edge design, which is the same as the design language of the iPhone 12 series and the new iMac. This design may give Apple Watch Series 7 a larger screen display area.
There are constantly breaking news that Apple will have greater action in the field of health. The space vacated by the SiP package may be used to house temperature sensors or blood glucose sensors. As the global new crown epidemic continues, the body temperature sensor may further boost the sales of Apple Watch Series 7.
Source: Lei Technology