This morning, Honor officially announced that it will release a new generation of 5G chip Hisilicon 820 online on March 30. This chip will be launched by Honor 30S and face the mainstream 5G market.
As can be seen from the name, Hisilicon Kirin 820 5G chip focuses on 5G networks and should support both SA / NSA dual-mode.
According to previous reports, Hisilicon Kirin 820 5G chip will use ARM Cortex-A76 CPU and Mali-G77 GPU architecture, 7nm or 6nm process. In addition to the ISP and NPU upgrades, this chip will also support Kirin Gaming + technology, and the NPU will follow Huawei's self-developed DaVinci architecture.
Compared with the previous Hisilicon Kirin 810, this chip uses a relatively new GPU architecture, the process may be upgraded, and 5G network support is added. With outstanding performance and reasonable price, Hisilicon Kirin 810 performed exceptionally well in the mainstream market last year. As an upgrade, Hisilicon Kirin 820 5G chip should have even better performance.
As the first product of Hisilicon Kirin 820 5G, the Honor 30S is expected to use a side fingerprint solution, a matrix rear four-camera module, a 40W power adapter, and will support higher power fast charging.
In the coming 5G era, mid-to-high-end phones that are more in line with mass consumer groups and perform well should be the choice of more people. So let's look forward to the Honor 30S and Hisilicon Kirin 820 5G chips on March 30th. The "core" will accelerate into the 5G era.