Realme X7 series configuration exposure: equipped with Dimensity 1000+ chip without 125W fast charge

Since the beginning of this year, OPPO’s new realme brand has ushered in explosive development this year. Only the real me X50 series has launched new machines such as X50, X50 Pro, X50 Pro player version, and then at the beginning of this month, realme launched a new realme My V5 series models have been widely praised by many young users. Not long ago, the realme mobile phone officially announced again that it will launch the new realme X7 series at 2 pm on September 1st. It is positioned as the flagship of 5G thin and light flash charging, and the realme family will further grow. Now there is the latest news. Recently, a well-known digital blogger broke the news that the machine will be equipped with MediaTek Dimensity 1000+ flagship processor.

According to a well-known digital blogger @数码闲聊站, the realme X7 series is equipped with the flagship MediaTek Dimensity 1000+ flagship processor, which uses the latest ARM A77+G77 high-performance core, and the CPU is 4xA77 2.6GHz+4xA55 2.0 GHz eight-core architecture, GPU is Mali-G77 graphics processor. AnTuTu’s running points exceeded 530,000, and its performance is in the first echelon. In terms of 5G, in addition to SA/NSA dual mode, it also supports 5G dual card dual standby and 5G dual carrier aggregation, realizing a full-featured 5G experience. In addition, the two versions of X7 and X7 Pro do not have 125W fast charging, and both are 65W fast charging.

In other respects, the new realme X7 series includes two products, the Real Me X7 and Real Me X7 Pro. It is positioned as the 5G thin and light flash charging flagship, with a full C-position halo. It is known as “the thinnest realme phone so far and the most so far. Good-looking realme phone”. The machine will be equipped with a 120Hz AMOLED flexible aperture screen with a resolution of FHD+, and a COP packaging process to achieve an ultra-narrow lower frame. According to Xu Qi, vice president of realme, compared to the two processes of COF and COG, COP directly bends a part of the soft material OLED screen backwards, thereby further reducing the border and achieving a visual effect close to “no border” At present, the COP process is only used for high-end flagship mobile phones.

It is reported that the new realme X7 series will be officially unveiled at 2 pm on September 1st. According to Xu Qi, as the first product of the new X series, the realme X7 series will meet everyone with a new look and new design. . More details, we will wait and see.